台湾品质,第八代Intel® Core™嵌入式无风扇整机MEC-3901

台湾品质,第八代Intel® Core™嵌入式无风扇整机MEC-3901

主要特点

支持第8代Intel®Core™i7/i5/i3 LGA插槽型嵌入式处理器

英特尔®Q370 PCH

支持1 x 2.5" SATA硬盘驱动器

1 x DVI-D, 1 x DP,和1 x HDMI与独立的显示支持

3个Intel®GbE局域网端口;支持WoL, team和PXE

1个M.2插座和1个SIM卡插座

6 x USB 3.0, 4 x USB 2.0, 2 x RS232/422/485自动流量控制

1个内置mini-PCIe插座,支持可选Wi-Fi/3.5G/4G LTE

支持+9V至30VDC输入;ATX电源模式

一个PCIe x4扩展

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商品描述

主要特点

支持第8代Intel®Core™i7/i5/i3 LGA插槽型嵌入式处理器

英特尔®Q370 PCH

支持1 x 2.5" SATA硬盘驱动器

1 x DVI-D, 1 x DP,和1 x HDMI与独立的显示支持

3个Intel®GbE局域网端口;支持WoL, team和PXE

1个M.2插座和1个SIM卡插座

6 x USB 3.0, 4 x USB 2.0, 2 x RS232/422/485自动流量控制

1个内置mini-PCIe插座,支持可选Wi-Fi/3.5G/4G LTE

支持+9V至30VDC输入;ATX电源模式

一个PCIe x4扩展


        集成第8代Intel®Core™i7/i5/i3处理器集成,MEC-3901系列是专为要求高CPU和图形性能的工业应用设计的无风扇PC。MEC-3901支持高达16G的DDR4内存,并在M.2、HDD或SSD等存储设备上有多个选项。MEC-3901支持从+9V到30V的直流输入,可以在-5到55摄氏度的工作温度范围内工作。为了扩展模块的可用性,MEC-3901还设计了一个内置的迷你pcie插座来支持物联网无线连接应用程序(支持可选的Wi-Fi、3.5G、4G LTE模块)。
CPU Support Support 8th generation Intel® Core™ i7/i5/i3 LGA socket type embedded processor
- Core™ i7-8700T, 6 Core, 2.4GHz, 12M Cache 
- Core™ i5-8500T, 6 Core, 2.1GHz, 9M Cache 
- Core™ i3-8100T, 4 Core, 3.1GHz, 6M Cache
Turbo-boost disabled by default
Main Memory 2 x DDR4 2400/2666 SO-DIMM socket, support up to 16GB with un-buffered and non-ECC
Display Option Three independent display
- HDMI + DP+ DVI-D
Dual independent display
- HDMI + DP
- HDMI + DVI-D
- DP + DVI-D
Front I/O Interface Status LEDs 3 x LAN active LEDs2 x GPO status/COM1/2 TX/RX LEDs1 x HDD access LEDs1 x Battery low1 x M.2
Front I/O Interface 1 x ATX power on/off switch1 x DP1 x Line-out and 1 x Mic-in2 x Antenna holes1 x External M.2 socket (M-key)1 x SIM card holder4 x USB 2.0 ports (500mA per each)
Rear I/O Interface 2 x DB9 for COM1 & COM2
- COM1: RS232/422/485 auto flow control
- COM2: RS232/422/485 auto flow control
6 x USB 3.1 ports (900mA per each)1 x DVI-D port1 x HDMI port2 x Intel® I210-IT GbE LAN ports; support WoL, teaming and PXE1 x Intel® I219-LM GbE LAN port1 x 3-pin remote power on/off switch+9V to 30V DC input
Internal I/O COM3/COM4: internal box header, support RS232 only8CH GPIO: internal pin header, support 4 x GPO and 4 x GPI, TTL 5V levelOn-board TPM2.0 (SLB9665) for data encryption purpose1 x Internal M.2 (B-key) support optional LTE
Storage Device 1 x External M.2 socket (M-key SATA 3.0, PCIe x4)1 x 2.5" HDD or SSD (SATA 3.0) driver bay
Expansion Slot One PCIe x4 expansion slot
- Add-on card length: 169mm max.
- Power consumption: 10W/slot max.
1 x Internal mini-PCIe socket support optional Wi-Fi/3.5G/4G LTE
Power Requirements AT/ATX power mode (default: ATX power mode)Power input: +9 to +30V DCPower adapter: optional AC to DC power adapter (24V DC, 120W)
Dimensions 215 mm(W) x 272mm (D) x 94mm (H) without wall mount bracket (8.5" x 10.7" x 3.7")
Construction Aluminum and metal chassis with fanless design
Environment Operating temperature: Ambient with air flow: -5°C to 55°
(according to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
Storage temperature: -20°C to 80°CRelative humidity: 10% to 95% (non-condensing)Shock protection:
- HDD: 20G, half sine, 11ms, IEC60068-2-27
- M.2: 50G, half sine, 11ms, IEC60068-2-27
Vibration protection with HDD condition:
- Random: 0.5Grms @ 5~500 Hz, IEC60068-2-64
- Sinusoidal: 0.5Grms @ 5~500 Hz, IEC60068-2-6
Vibration protection with SSD & M.2 condition: 
- Random: 2Grms @ 5~500 Hz, IEC60068-2-64.
- Sinusoidal: 2Grms @ 5~500 Hz, IEC60068-2-6
Certifications CE approval- EN61000-6-2- EN61000-6-4FCC Class A
OS Support Lists Windows 10 64-bitLinux Kernel 4.9
Weight Information Gross weight: 6.54kgNet weight: 5kg

MEC-3901 System (P/N: 10J00390000X0)

第8代Intel®Core™i7/i5/i3无风扇系统,一个PCIe x4扩展

24V, 120W AC to DC power adapter w/o power cord (P/N: 7400120023X00)